Inkjet printed PCB on FR4 board

Printed PCB w/ components added

Silver conductive ink printed direct on Kapton film w/ dielectric protective layer on top

Printed dielectric material layered to build rigid connecting point for solder terminals

Silver conductive ink direct on FR4 board

Silver conductive ink w/ dielectric base layer on PET film

Silver conductive ink on FR4 thin board

Antennae printed w/ silver ink & dielectric on paper and PET

NFC chip array printed w/ silver ink and dielectric on PET

Dielectric building material for base layer board

Silver traces and LED lights set into board (optional color tint added to building material)

Final layers of dielectric building material cover and encapsulate (protect) circuit components

Final functioning product